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| Artikel-Nr.: 5667A-9783662131633 Herst.-Nr.: 9783662131633 EAN/GTIN: 9783662131633 |
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| The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. Weitere Informationen: | | Author: | Frank Riley; Electronic Packaging and Production | Verlag: | Springer Berlin | Sprache: | eng |
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| Weitere Suchbegriffe: chemische technik - englischsprachig, Local Area Network; Standard; coating; computer; Design; Development; Manufacturing; reliability; Robotics; Simulation; structured design; testing, Local Area Network, Standard, coating, computer, design, development, electronics, manufacturing, production, reliability |
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